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Koh Young Technology, a leading provider of 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for global circuit board assembly and semiconductor markets.
The company’s 3D SPI and AOI systems enable the user to compile quantitative data after each manufacturing step that can be used to check the quality of the product, eliminating the possibility of serious defects at each productions stage and significantly increasing efficiency.
Koh Young’s Zenith is the only fully automated in-line AOI system that delivers true 3D measurement based inspection of whole assembled PCBs. Its powerful defect detection based on real 3D profilometric measurements achieves process optimization without significant involvement of human resources, which enhances efficiency and reduces defects while cutting costs.
In addition, the company’s aSPIre 2 is the only 3D SPI system that provides a complete solution to the common bottlenecks that hinder conventional inspection systems.
Founded in 2002, Koh Young is one of the world’s leaders in 3D measurement and inspection with a 50% share of the SPI market. The company developed the world’s first 3D measurement-based AOI system as well as the world’s first 3D solution for packaging inspection.
Koh Young’s main users include global manufacturers of automobile components and smart devices, server products, defense and aerospace products, semi-conductors, and home appliances.
As of late 2011, Koh Young’s client list includes over 700 companies worldwide.
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