Koh Young Technology Inc.
INTRODUCTION
PRODUCT LIST
Automated 3D Solder Paste Inspection System
Today¡¯s high-performance circuit assemblies found in every type of product from cell phones to luxury automobiles to jet fighters are assembled using solder to connect the components. Solder is applied in a ¡®paste¡¯ form in very precise amounts during manufacturing. Automated Solder Paste Inspection (SPI), used to detect defects in solder paste, is necessary to ensure a robust manufacturing process for high reliability products.
Automated 3D Solder Paste Inspection System
Today¡¯s highperformance circuit assemblies found in every type of product from cell phones to luxury automobiles to jet fighters are assembled using solder to connect the components. Solder is applied in a ¡°paste¡± form in very precise amounts during manufacturing.
3D SPI and 3D AOI Systems
Koh Young Technology, a leading provider of 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for global circuit board assembly and semiconductor markets.
3D SPI and 3D AOI Systems
Koh Young Technology¡¯s 3D automated optical inspection (AOI) systems and solder paste inspection (SPI) enable the user to compile quantitative data after each manufacturing step that can be used to check the quality of the product, eliminating the possibility of serious defects at each production stage and increasing efficiency significantly.
