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Fusei Menix was founded in 1983 and first began manufacturing equipment for semiconductor production.
Over the next 30 years the company has preserved this core competence in semiconductor manufacturing equipment and currently offers several lines of products in transfer molding presses, PCB laminating systems, and vacuum laminators.
Fusei Menix’s vacuum hot press is a major component of PCB laminating systems that form an integral part of PCB layer deposit systems.
Vacuum hot presses must provide even pressure and temperature application as well as uniform vacuum levels. The rising trend for ultra-precise PCBs today calls for extremely uniform pressure distribution.
Fusei Menix’s vacuum hot press has been designed to meet this need. FUSEI’s vacuum hot press is used for rigid PCB, package substrates, MLB, HDI and special PCBs such as metal and ceramic PCBs.
Leading global semiconductor manufacturers including Samsung, LG, FOXCONN, IR and ASE use Fusei Menix’s vacuum presses.
The company has received ISO 9001 certification as well as the CE mark and other quality and safety certifications.
In addition, it operates its own research facility that has produced many of the innovations currently used in Fusei Menix’s leading products.
The company owns 29 patents including technology for vacuum hot presses for multilayer PCBs, the company’s core product.
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