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Hynix has successfully developed high performance e- NAND (eMMC) products based on 2xnm 64Gb MLC (Multi
Level Cell) NAND Flash components. The highly integrated eMMC in 16-64GB densities are compatible with JEDEC
eMMC 4.41, the international standard for embedded multimedia cards. Hynix provides customer samples to
controller companies from February 2011.
These products have a superior NAND Flash firmware with advanced features such as ECC (Error Correction Code)
, wear-leveling, and strong data protection against power loss. These features simplify both Hardware and Software
designs of end-use applications.
Their functional features include full compatiblity with Multi Media Card (MMC) system spec. version 4.4, support
of full backward compatibility with legacy Multi Media Card system, data bus width(1bit, 4bit, 8bit), MMC Interface
Clock Frequency (0 ~52MHz), up to 64GB of formatted data storage, and Partition management with enhanced storage.
The company’s highly optimized FTL (Flash Translation Layer) algorithm targeting the mobile applications that
enable fast random read/write and guarantees data security will be meeting customers’ needs for efficient embedded
mobile storage. Amid the increasing demand for high density storage in applications such as Smartphone and Tablet PC, Hynix further plans to respond effectively by offering 16/32/64GB NAND products based on the new 2xnm 64Gb NAND
Flash component. Hynix has strengthened its status as a leading semiconductor company in many regions, including
China, which is now the biggest semiconductor market in the world. Hynix aims to become a long-lasting and major
company, recognized as the best memory solution provider.
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