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Automated 3D Solder Paste Inspection System

[Automated 3D Solder Paste Inspection System]
Today¡¯s highperformance circuit assemblies found in every type of product from cell phones to luxury automobiles to jet fighters are assembled using solder to connect the components. Solder is applied in a ¡°paste¡± form in very precise amounts during manufacturing.

Automated Solder Paste Inspection (SPI), used to detect defects in solder paste, is necessary to ensure a robust manufacturing process for high reliability products.

Koh Young Technology, Inc., established in 2002, is the global leader in SPI analysis systems. Koh Young¡¯s aSPIre 2 is a fully-automated in-line SPI system that delivers 100% patented 3D Inspection of solder paste with unmatched speed and camera accuracy.

Its powerful analytical tools and hardware combine to deliver the highest level of process optimization for high-throughput environments where best first-pass yields and zero defect manufacturing are demanded. Its 3D SPI measurement is the most accurate and precise SPI technology available.

Koh Young Technology specializes in the design and manufacturing of 3D metrology and inspection equipment for the global circuit board assembly and semiconductor markets in countries around the world. Koh Young is certified to ISO 9001 & ISO 14001 quality standards.
15th Floor Halla Sigma Valley Building, 345-90, Gasan-dong, Geumcheon-gu, Seoul 153-802, Korea
E-mail: kohyoung@kohyoung.com
Tel: (82-2)6343-6000
Fax: (82-2)6343-6001
Website: www.kohyoung.com
 
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