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South Korea's World's Leading Semiconductor Companies Speeding up Release of Innovative Semiconductor Items

South Korea¡¯s World¡¯s Leading Semiconductor Companies Speeding up Release of Innovative Semiconductor Items
Amid the growing overseas demand for system semiconductors, South Korea¡¯s computer chip exports are expected to
reach US$52.5 billion in 2011.
According to the data officially released by the government, the total shows a growth of 3.5 percent compared to the
previous year, with outbound shipments of system semiconductors used to make products like smartphones and tablet
PCs increasing 18.7 percent on-year to $19.1 billion.
System chip exports rose to $16.1 billion in 2010 from $12.3 billion in 2009.
An overall increase during the period is expected despite a 9.3 percent drop in conventional memory chip exports
triggered by lower market prices.
The data show that local computer chip companies should increase overall facility investments by 4.5 percent on-year
to $12.4 billion in 2011, with investment numbers for system semiconductors expected to surge 96.8 percent on-year to
$4.1billion.
The data highlighted the fact that it is important to invest more than ever into the areas of fourth-generation
baseband modem chip, application processor and radio frequency integrated circuit, or so-called RFIC chipsKorea¡¯s large semiconductor companies are accelerating the release of several kinds of world-first, high-end
semiconductor items.
Hynix Semiconductor Inc., the world¡¯s No. 2 maker of computer memory chips, has developed the world¡¯s first
largest-size dynamic random access memory (DRAM) for a single package. Using its new technology, Hynix succeeded in
stacking eight 2-gigabit DDR3 DRAM chips in a single package. The achievement marks the world¡¯s first 16-gigabit
memory integrated into a single package.
The newly developed device can hold up to 64 gigabytes and can be widely used to meet demand for large-size
memory in servers and other products.
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, has recently developed the world¡¯s
first 1 GB (gigabit) mobile DRAM with a wide I/O interface, using 50 nanometer class process technology. The new wide
I/O mobile DRAM will be used in mobile applications, such as Smartphones and tablet PCs.
Samsung Electronics has also recently released its new 1/3.2-inch 8 Megapixel (Mp) CMOS imager, S5K3H2. The new
imager utilizes the company¡¯s advanced 1.4 micron(um) rear-illuminated (BSI) pixel technology to offer superior lowlight
sensitivity, fully meeting the high-quality imaging requirements of various kinds of devices, such as smartphones,
high-end feature phones, DSLR cameras, DVC/DSCs, and camera embedded displays and game applications.
Following these two major pieces of news, Samsung Electronics has also recently reportedly announced its 1GHz,
dual-core application processor, Exynos 4210, initially announced as Orion, has been chosen to power Samsung¡¯s latest
flagship smartphone, Samsung Galaxy S II.
Large-scale Korean semiconductor manufacturers are increasingly dominating the global market for semiconductors,
thanks to their continuous R&D investments and their cost-cutting efforts.
Samsung Electronics¡¯ global market share in the key component of personal computers stood at 41.7 percent in the
October-December period of last year, up 1 percentage point from the previous three months, according to the market
research firm iSuppli Corp. DRAM devices helped run multiple programs simultaneously on personal computers.
Hynix Semiconductor Inc. the world¡¯s No. 2 DRAM maker after its domestic rival Samsung, accounted for 21.8 percent
of the market in the same period, followed by Elpida Memory Inc. with 13 percent and Micron Technology Inc.¡¯s 12.5
percent.
Samsung retained the lead in the global NAND flash market as well, according to another industry source. NAND flash
memory stores data in portable devices, such as music players, digital cameras and mobile phones. Samsung claimed
37.5 percent of the global NAND flash market in the fourth quarter, marginally outperforming Toshiba Corp., which
accounted for 35.5 percent of the market. Micron held a 10.7 percent market share in the same period, trailed by Hynix
with 10.4 percent and Intel Corp.¡¯s 5.9 percent, respectively.
Large-scale global domestic chip makers, including Samsung, Hynix, reportedly achieved significant profits in the
fourth quarter of last year thanks to their advanced technologies and cost-cutting efforts despite slowing PC demand
and a global chip glut.
Their global rivals in Japan and Taiwan, however, fell into difficulties as they were badly hit by plunging chip prices..

FPD Equipment

AKT is responsible for more than 80% of the entire global market of LCD PE CVD equipment, as the size of equipment is growing larger. JUSUNG successfully developed new technology and entered the market after four years of R&D investment. Currently, the company has 6th, 7th, and 8th generation equipment together, which are the flagship models of major LCD makers.

SDCVD Equipment

SDCVD (Space divided CVD-ALD) is one of the most advanced and promising thin film technologies. Thanks to its superior film qualities including impurity-free film, excellent step coverage, good uniformity and lower process temperature, SDCVD is expected to soon replace conventional thin film technologies such as CVD and PVD.

Semiconductor Equipment

JUSUNG has unique technology for dealing with film deposition equipment for semiconductor elements, including selective semi-spherical silicon deposition and atomic layer deposition, and the company was recognized as the No.1 in global market share by an independent nternational research organization.

2xnm 64Gb based e-NAND (eMMC)

Hynix has successfully developed high performance e- NAND (eMMC) products based on 2xnm 64Gb MLC (Multi Level Cell) NAND Flash components. The highly integrated eMMC in 16-64GB densities are compatible with JEDEC eMMC 4.41, the international standard for embedded multimedia cards. Hynix provides customer samples to controller companies from February 2011.

World¡¯s First 4xnm 1 GB GDDR5

As one of the world¡¯s top-tier memory semiconductor suppliers, Hynix Semiconductor Inc. offers Dynamic Random Access Memory chips (¡°DRAMs¡±), Flash memory chips (¡°NAND Flash¡±) and CMOS Image Sensor (¡°CIS¡±) to a wide range of distinguished customers globally.

Low-power Dual-Core Application Processor Powers Samsung Galaxy S II

Samsung Electronics has recently announced its 1GHz, dual-core application processor, Exynos 4210, initially announced as Orion, which it has chosen to power Samsung¡¯s latest flagship smartphone, Samsung Galaxy S II. It is specially designed to meet the high-performance and low-power needs of advanced mobile applications. Exynos 4210 application processor allows device manufacturers to develop products that offer consumers the richest computing experience.

8 Megapixel CMOS Imager for Quality Image Features on High-end Mobile Phones

Samsung Electronics has recently released its new 1/3.2- inch 8 Megapixel (Mp) CMOS imager, S5K3H2. The new imager utilizes the company¡¯s advanced 1.4 micron (um) back side illuminated (BSI) pixel technology to offer superior low-light sensitivity, fully meeting the high-quality imaging requirements of various kinds of devices, such as smartphones, high-end feature phones, DSLR cameras, DVC/DSCs, and camera embedded displays and game applications.

Mobile DRAM with Wide I/O Interface

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, has recently developed the world first 1 GB (gigabit) mobile DRAM with a wide I/O interface, using 50 nanometer class process technology. The new wide I/O mobile DRAM will be used in mobile applications, such as Smartphones and tablet PCs.

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